See Alpha and Omega Semiconductor at PCIM 2026 to Learn About Their Advanced AI Core Power, AI Data Center, and Industrial Power Solutions
Breakthrough products meet intensifying AI performance, enhanced protection, and thermal management needs while maximizing design flexibility and end-to-end system efficiency
SUNNYVALE, Calif., June 1, 2026 – Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules will exhibit its latest power management solutions that meet increasing AI core power, AI data center and industrial power needs at the PCIM Expo 2026. Attendees are invited to see the product advancements that enable developers to overcome design challenges by safely maximizing performance, boosting efficiency, matching board-space limitations, and meeting AI power-delivery requirements. The key application area solutions shown in the AOS booth include:
AI Core Power and High-end Computing:
AOS introduced several new power management solutions for AI computing, graphics, and next-generation notebook applications. Highlights include the AOZ73216QI and AOZ73104QI controllers for high-performance GPUs and SoCs in AI data centers, and new Type-C EPR 3.1 protection switches supporting safe, reliable power delivery up to 240W for next-generation USB Type-C applications. The AOZ13058DI offers overvoltage/ overcurrent protection features suited for 48V Type-C sinking applications, while the AOZ15953DI provides the additional protection features needed for Type-C sourcing applications.
AI Data Center:
AOS Expands its AI data center power portfolio with advanced MOSFET, αSiC, and GaN solutions designed for 48V/54V and emerging 800 VDC power architectures. The company’s latest devices support high-density DC/DC and AC/DC conversion with improved thermal performance, ultra-low switching losses, and compact, cooling-efficient designs for AI servers and accelerators. Key innovations include double-sided-cooling MOSFETs, third-generation αSiC devices for efficient high-voltage conversion, GaN FETs for compact high-frequency power delivery, and rugged hot-swap solutions that enhance reliability and efficiency in demanding AI factory environments.
Industrial Power:
BLDC motor solution portfolio featuring advanced MOSFETs, motor driver ICs, and dual-core motor control MCUs for applications ranging from power tools and outdoor equipment to e-mobility systems. Its low-loss MOSFETs and GTPAK™ topside-cooling technology improve thermal and electrical performance, while integrated 3-phase and half-bridge driver ICs simplify design and enhance protection features. Complementing these are highly integrated dual-core MCU solutions that support efficient sensor-less and sensored motor control with advanced FOC and PWM capabilities for high-performance motor applications.
Where: PCIM Expo 2026, Nuremberg Exhibition Centre, Nuremberg
When: June 9 - 11, 2026
Location: Alpha and Omega Semiconductor Booth #9-539