Alpha and Omega Semiconductor’s New αMOS E2™ 600V Super Junction MOSFETs Support Optimized Electrical/Thermal Paths, Boosted System Performance and Long-Term Reliability

SUNNYVALE, Calif., Sep. 8, 2026 – Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide-bandgap power devices, power management ICs and modules, today announced the release of αMOS E2™ 600V Super Junction MOSFETs: AOGT037V60DE2 and AOGT060V60DE2. AOS engineered its newly developed αMOS E2 High‑Voltage MOSFET platform to meet the growing demands for enhanced efficiency and increased power density management capabilities. These 600V Super Junction MOSFETs provide excellent performance across a wide range of today’s higher voltage applications, including servers, workstations, telecom rectifiers, solar inverters, motor drives and industrial power systems.

Users of the latest high-performance SMPS and solar inverters expect higher efficiency, greater power density, lower system cost and uncompromising robustness. The advanced technology features in AOS’ top-side-cooled high-voltage Super Junction MOSFETs address these needs. These devices also meet the critical requirements in multiple topologies such as boost PFC, totem-pole PFC (slow leg), LLC resonant, PSFB and cyclo-converters.

AOS’ αMOS E2 High‑Voltage Super Junction MOSFET platform features exceptional body-diode ruggedness (di/dt = 1500 A/µs), superior avalanche (UIS) capability, and short-circuit withstand time (SCWT). This enhanced ruggedness translates into higher system-level reliability, helping to ensure robust operation even under abnormal scenarios. Furthermore, AOS combines this αMOS E2 silicon with its top-side-cooled GTPAK™ package to maximize thermal performance via the top-side cooling pad. As a result, system designers can fully optimize thermal dissipation and reclaim PCB space to maximize overall power density. By co-optimizing both the electrical and thermal paths, system performance and long-term reliability are greatly enhanced.  

“Our top-side cooled GTPAK products, such as the AOGT037V60DE2 and AOGT060V60DE2, are engineered to meet the demands of high-performance AC/DC power supplies, DC/DC converters and DC/AC solar inverters. Electromagnetic emission (EMI) and density bottlenecks of traditional bottom-side cooling have been a major engineering hurdle. Our αMOS E2 top-side cooled solutions give designers a premier solution for mid-to-high-power systems, empowering the performance-driven power infrastructure, power supply units, and renewable energy systems,” said Simon Yu, Senior Manager of HV Product Line at AOS.

Technical Highlights

• Top-Side Cooled Package maximizes power density by co-optimizing both the electrical and thermal paths.
• Gull-Wing Leads deliver superior board-level reliability in mission-critical environments.
• Robust built-in fast body diode reduces Qrr for high-stress applications
• Enhanced robustness with strong UIS, inrush current handling, and wide SOA capabilities
• Designed to prevent self-turn‑on, ensuring reliable operation under dynamic conditions
• Suitable for Boost PFC, Totem Pole PFC, LLC, PSFB, and CrCM H-4/Cyclo Inverter applications

Pricing and Availability

The AOGT037V60DE2 (600 V, 37 mΩ) and AOGT060V60DE2 (600 V, 60 mΩ) in top-side-cooled GTPAK packages are now available in production quantities with a lead time of 16 weeks. The unit prices for 1,000-piece quantities are $6.00 and $3.00, respectively.